Electronics Test Method Finder
Use the sliders to set your requirements to compare key PCB testing methods including AOI, AXI, Bed of Nails, Functional Test, Flying Probe and JTAG Boundary Scan
Signals
Complex ICs (FPGA, CPLD, MCU, SoC)
Number Of Programmable Devices (NAND, NOR, eMMC Flash)
Passives Count
Layer Count
Development Stage
Implementation Deadline
Test Budget
Finished Product Value
Production Volume
Quality Environment
Your Recommended Test method Is X
Your needs (in yellow) are based on your answers. Click a test method to compare with your needs. Go back to previous sections to adjust your choices.
Functional Test
A comprehensive testing approach that verifies the complete functionality of a device by testing it under real-world operating conditions. This method ensures that all components work together as intended.
Pros
- Tests complete system functionality as designed
- Catches integration issues
- Validates real-world performance
Cons
- Coverage of edge-cases can be low
- Requires bespoke development for each project
- Limited debug and troubleshooting
JTAG Boundary Scan
A standardized test method that uses dedicated test circuitry embedded in integrated circuits to test interconnects and verify component functionality without physical test probes.
Pros
- No physical access required on complex PCBs
- Can easily be added to or combined with other methods
- Built-in self-test capability
Cons
- Test speed may be limited by JTAG chain speed
- May require early test involvement in development cycle
- Requires custom test script development
For JTAG Boundary Scan we recommend XJTAG.
Automated Optical Inspection
A visual inspection system that uses cameras and image processing to detect manufacturing defects, component placement issues, and soldering problems on PCBs.
Pros
- Fast inspection speed
- No physical contact needed
- Easy to implement and repurpose to new projects
Cons
- Limited to visible surfaces
- Can't detect internal defects
- Requires controlled test environment on production line
Bed of Nails
A testing fixture that uses multiple spring-loaded pins to make simultaneous contact with test points on a PCB, enabling rapid electrical testing of multiple points.
Pros
- Very fast testing speeds
- Suitable for automated production lines
- High test coverage of non-finished products
Cons
- High fixture cost and ime to implement
- Design changes often require complete redesign
- Requires development for test point access
Flying Probe Test
A flexible testing system that uses moving test probes to make contact with test points on a PCB, offering a cost-effective solution for low-volume production and prototype testing.
Pros
- No fixture required
- Highly flexible
- Good for prototypes
Cons
- Slower test speeds
- Limited test point access
- Higher maintenance cost
Automated X-ray Inspection
An advanced inspection technique that uses X-ray imaging to detect defects in hidden solder joints, internal structures, and complex assemblies that cannot be seen with optical inspection.
Pros
- Sees internal structures within board layers
- Good for complex IC inspection
- Easy to implement by comparison to 'golden board'
Cons
- High equipment cost
- High test time to image at high resolution
- Requires safety precautions
For Automated X-ray Inspection we recommend Nordson and TRI Innovation.